- 专利标题： Casing, electronic device employing same and manufacturing method
-
申请号： US14826420申请日： 2015-08-14
-
公开(公告)号： US09730370B2公开(公告)日： 2017-08-08
- 发明人: Chia-Wen Tsao
- 申请人： FIH (HONG KONG) LIMITED
- 申请人地址： HK Kowloon
- 专利权人： FIH (HONG KONG) LIMITED
- 当前专利权人： FIH (HONG KONG) LIMITED
- 当前专利权人地址： HK Kowloon
- 代理商 Steven Reiss
- 优先权： CN201410812398 20141224
- 主分类号： H05K13/00
- IPC分类号： H05K13/00 ; H04M1/02 ; H04B1/3888 ; H01Q1/24
摘要：
A casing includes a cover and a frame coupled to the cover. The frame includes a base body and a plurality of non-conductive portions. The base body defines a plurality of gaps spaced from each other. The non-conductive portions are correspondingly inserted into the gaps to insulate opposite sides of each gap. A manufacturing method and an electronic device of the casing are also provided.
公开/授权文献
信息查询
