Invention Grant
- Patent Title: Articles with lamination transfer films having engineered voids
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Application No.: US15206757Application Date: 2016-07-11
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Publication No.: US09731473B2Publication Date: 2017-08-15
- Inventor: Evan L. Schwartz , Justin P. Meyer , Olester Benson, Jr. , Terry O. Collier , Michael Benton Free , Robert F. Kamrath , Mieczyslaw H. Mazurek , David B. Olson , K. Raveesh Shenoy , Martin B. Wolk
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN Saint Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN Saint Paul
- Main IPC: B32B3/26
- IPC: B32B3/26 ; B32B27/30 ; B32B37/18 ; B32B38/00 ; H01L51/52 ; B32B38/06 ; G03F7/09 ; B29D11/00 ; H01L51/00 ; B32B38/18 ; B32B37/12 ; B29K83/00

Abstract:
Transfer films, articles made therewith, and methods of making and using transfer films to form bridged nanostructures are disclosed.
Public/Granted literature
- US20160318277A1 ARTICLES WITH LAMINATION TRANSFER FILMS HAVING ENGINEERED VOIDS Public/Granted day:2016-11-03
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