Invention Grant
- Patent Title: Electronic module and fabrication method thereof
-
Application No.: US14516010Application Date: 2014-10-16
-
Publication No.: US09735075B2Publication Date: 2017-08-15
- Inventor: Lu-Yi Chen , Chang-Lun Lu , Shih-Ching Chen
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103130349A 20140903
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H01L23/16 ; H01L23/31 ; H01L21/56 ; H01L23/00
Abstract:
An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.
Public/Granted literature
- US20160066406A1 ELECTRONIC MODULE AND FABRICATION METHOD THEREOF Public/Granted day:2016-03-03
Information query
