发明授权
- 专利标题： Package substrate, method for making the same, and package structure having the same
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申请号： US15338548申请日： 2016-10-31
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公开(公告)号： US09735097B1公开(公告)日： 2017-08-15
- 发明人: Yi-Ho Chen
- 申请人： Qi Ding Technology Qinhuangdao Co., Ltd.
- 申请人地址： CN Qinhuangdao
- 专利权人： Qi Ding Technology Qinhuangdao Co., Ltd.
- 当前专利权人： Qi Ding Technology Qinhuangdao Co., Ltd.
- 当前专利权人地址： CN Qinhuangdao
- 代理商 Steven Reiss
- 优先权： CN201610544263 20160712
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48 ; H01L23/00
摘要：
A package substrate includes a first conductive wire layer having a first end portion and a second end portion opposite to the first end portion. A width of the first end portion is greater than that of the second end portion. An isolating layer covers the second end portion and contains the first conductive wire layer. The isolating layer defines blind holes which have conductive portions. A second conductive wire layer covers the isolating layer, and includes a third end portion facing the second end portion and a fourth end portion opposite to the third end portion. A width of the third end portion is greater than that of the fourth end portion. Solder mask layers are formed on the first conductive wire layer and on the second conductive wire layer, each solder mask layer defining an opening.
信息查询
IPC分类:
