Invention Grant
- Patent Title: Method for surface treatment of upper electrode, plasma processing apparatus and upper electrode
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Application No.: US15130188Application Date: 2016-04-15
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Publication No.: US09741540B2Publication Date: 2017-08-22
- Inventor: Yusuke Aoki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2015-086200 20150420
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67

Abstract:
In a method for surface treatment of an upper electrode, a first step is performed to roughen a facing surface of the upper electrode facing a lower electrode while depositing a CF-based deposit on the facing surface by using a plasma of a processing gas by supplying a first and second high frequency powers to the lower and upper electrode. A second step is performed to remove a part of the CF-based deposit by using a plasma of a processing gas by supplying the second high frequency power to the upper electrode only, and a third step is performed to remove the CF-based deposit remaining in the second step by using a plasma of a processing gas by supplying the first and second high frequency powers to the lower and upper electrode. Further, the first, second and third steps are repeated multiple times.
Public/Granted literature
- US20160307741A1 METHOD FOR SURFACE TREATMENT OF UPPER ELECTRODE, PLASMA PROCESSING APPARATUS AND UPPER ELECTRODE Public/Granted day:2016-10-20
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