- 专利标题： Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
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申请号： US13959995申请日： 2013-08-06
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公开(公告)号： US09748043B2公开(公告)日： 2017-08-29
- 发明人: Antony P. Chacko , John E. McConnell , Robert Ramsbottom , Philip M. Lessner , Randolph S. Hahn , John Bultitude
- 申请人： Kemet Electronics Corporation
- 申请人地址： US SC Simpsonville
- 专利权人： KEMET Electronics Corporation
- 当前专利权人： KEMET Electronics Corporation
- 当前专利权人地址： US SC Simpsonville
- 代理机构： Perkins Law Firm, LLC
- 代理商 Joseph T. Guy
- 主分类号： H01G9/048
- IPC分类号： H01G9/048 ; H01G9/00 ; H01G9/012 ; H01G11/26 ; H01G9/04 ; H01G9/042
摘要：
A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
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