Invention Grant
- Patent Title: Systems and methods for splicing wires
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Application No.: US14472727Application Date: 2014-08-29
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Publication No.: US09748675B2Publication Date: 2017-08-29
- Inventor: David Howard Syck , Gregory Quentin Brown , Kurt Kramer Schleif , Andrea Booher Kretschmar
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Agency: Eversheds Sutherland (US) LLP
- Main IPC: H01R4/70
- IPC: H01R4/70 ; H01R4/10 ; H01R4/20

Abstract:
A splicer device is disclosed herein. The splicer device includes a main body having an internal passage formed between a first end of the main body and a second end of the main body. The first end of the main body is configured to receive at least one first wire, and the second end of the main body is configured to receive at least one second wire. A window is disposed within the main body and in communication with the internal passage between the first end of the main body and the second end of the main body for accessing and splicing the at least one first wire and the at least one second wire.
Public/Granted literature
- US20160064835A1 SYSTEMS AND METHODS FOR SPLICING WIRES Public/Granted day:2016-03-03
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