- 专利标题: Acoustic wave device and method of fabricating the same
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申请号: US14290746申请日: 2014-05-29
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公开(公告)号: US09751109B2公开(公告)日: 2017-09-05
- 发明人: Akira Moriya , Osamu Kawachi
- 申请人: TAIYO YUDEN CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人: TAIYO YUDEN CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Chen Yoshimura LLP
- 优先权: JP2013-117326 20130603
- 主分类号: H03H9/25
- IPC分类号: H03H9/25 ; B06B1/06 ; H03H3/08 ; H03H9/05 ; H03H9/10
摘要:
An acoustic wave device includes: a support substrate; a piezoelectric substrate; and a cap substrate, wherein the cap substrate includes a first region located along an outer peripheral portion of the cap substrate, a second region located along an inside of the first region and having a thickness less than a thickness of the first region, and a third region located inside the second region and having a thickness less than a thickness of the second region, and a surface of the first region is bonded to the surface of the outer peripheral portion of the support substrate, a surface of the second region is bonded to a surface of an outer peripheral portion of the piezoelectric substrate, and a surface of the third region is located away from a surface of the piezoelectric substrate to form a space for the excitation electrode to vibrate.
公开/授权文献
- US20140354114A1 ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME 公开/授权日:2014-12-04
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