Invention Grant
- Patent Title: High-throughput DNA fragment assembly
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Application No.: US14416799Application Date: 2013-07-23
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Publication No.: US09752154B2Publication Date: 2017-09-05
- Inventor: Sandeep Kumar , Steven L. Evans , Manju Gupta
- Applicant: DOW AGROSCIENCES LLC , Sandeep Kumar , Steven L. Evans , Manju Gupta
- Applicant Address: US IN Indianapolis
- Assignee: Dow AgroSciences LLC
- Current Assignee: Dow AgroSciences LLC
- Current Assignee Address: US IN Indianapolis
- Agent Yung H. Lee
- International Application: PCT/US2013/051641 WO 20130723
- International Announcement: WO2014/018512 WO 20140130
- Main IPC: C12N15/68
- IPC: C12N15/68 ; C12N15/82

Abstract:
This invention is related to methods and systems for vector assembly for transgenic plants. A uniform modular process is used to reduce cycle time and the methods and systems provided herein can increase cloning throughput using multiple-well plates, for example 96-well plates. In some embodiments, the methods and systems provided herein eliminate or reduce the need for sequencing confirmation because no PCR is involved in the vector assembly process.
Public/Granted literature
- US20150176015A1 HIGH-THROUGHPUT DNA FRAGMENT ASSEMBLY Public/Granted day:2015-06-25
Information query
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