- 专利标题： Sputtering target for PVD chamber
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申请号： US12723199申请日： 2010-03-12
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公开(公告)号： US09752228B2公开(公告)日： 2017-09-05
- 发明人: Zhendong Liu , Rongjun Wang , Xianmin Tang , Srinivas Gandikota , Tza-Jing Gung , Muhammad M. Rasheed
- 申请人： Zhendong Liu , Rongjun Wang , Xianmin Tang , Srinivas Gandikota , Tza-Jing Gung , Muhammad M. Rasheed
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Servilla Whitney LLC
- 主分类号： C23C14/34
- IPC分类号： C23C14/34 ; H01J37/34
摘要：
Target assemblies and PVD chambers including target assemblies are disclosed. The target assembly includes a target that has a concave shaped target. When used in a PVD chamber, the concave target provides more radially uniform deposition on a substrate disposed in the sputtering chamber.
公开/授权文献
- US20100252416A1 Sputtering Target for PVD Chamber 公开/授权日：2010-10-07
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