Invention Grant
- Patent Title: Coplanar process fluid pressure sensor module
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Application No.: US14282367Application Date: 2014-05-20
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Publication No.: US09752945B2Publication Date: 2017-09-05
- Inventor: Robert C. Hedtke , David A. Broden
- Applicant: Rosemount Inc.
- Applicant Address: US MN Shakopee
- Assignee: Rosemount Inc.
- Current Assignee: Rosemount Inc.
- Current Assignee Address: US MN Shakopee
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: G01L13/02
- IPC: G01L13/02 ; G01L9/00 ; G01L19/00 ; G01L19/14

Abstract:
A coplanar process fluid pressure sensor module is provided. The module includes a coplanar base and a housing body. The coplanar base has a pair of process fluid pressure inlets, each having an isolator diaphragm. The housing body is coupled to the coplanar base at an interface between the coplanar base and the housing body. A differential pressure sensor is operably coupled to the pair of process fluid pressure inlets, and is disposed proximate the coplanar base within the housing body.
Public/Granted literature
- US20140251019A1 COPLANAR PROCESS FLUID PRESSURE SENSOR MODULE Public/Granted day:2014-09-11
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