Invention Grant
- Patent Title: Electrodes for etch
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Application No.: US14042490Application Date: 2013-09-30
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Publication No.: US09754765B2Publication Date: 2017-09-05
- Inventor: Banqiu Wu , Saravjeet Singh , Amitabh Sabharwal , Ajay Kumar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01J37/32
- IPC: H01J37/32
Abstract:
An electrode having a first portion and a second portion is formed over a substrate to couple to a bias RF power. The first portion is configured to compensate for an electric field at the second portion to even out a distribution of an etching strength over a workpiece placed over the electrode.
Public/Granted literature
- US20150090401A1 NOVEL ELECTRODES FOR ETCH Public/Granted day:2015-04-02
Information query
