Invention Grant
- Patent Title: Electronic component of integrated circuitry and a method of forming a conductive via to a region of semiconductor material
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Application No.: US14975746Application Date: 2015-12-19
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Publication No.: US09754889B2Publication Date: 2017-09-05
- Inventor: Deepak Chandra Pandey , Haitao Liu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/535 ; H01L21/768 ; H01L23/528
Abstract:
An electronic component of integrated circuitry comprises a substrate comprising at least two terminals. Material of one of the terminals has an upper surface. A conductive via extends elevationally into the material of the one terminal. The conductive via extends laterally into the material of the one terminal under the upper surface of the one terminal. Material of the one terminal is above at least some of the laterally extending conductive via. Other embodiments, including method embodiments, are disclosed.
Public/Granted literature
Information query
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