- 专利标题: Trench epitaxial growth for a FinFET device having reduced capacitance
-
申请号: US14577431申请日: 2014-12-19
-
公开(公告)号: US09755031B2公开(公告)日: 2017-09-05
- 发明人: Qing Liu , Xiuyu Cai , Ruilong Xie , Chun-Chen Yeh
- 申请人: STMicroelectronics, Inc. , International Business Machines Corporation , GlobalFoundries Inc
- 申请人地址: US TX Coppell US NY Armonk KY Grand Cayman
- 专利权人: STMicroelectronics, Inc.,International Business Machines Corporation,GlobalFoundries Inc.
- 当前专利权人: STMicroelectronics, Inc.,International Business Machines Corporation,GlobalFoundries Inc.
- 当前专利权人地址: US TX Coppell US NY Armonk KY Grand Cayman
- 代理机构: Gardere Wynne Sewell LLP
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/417 ; H01L29/66 ; H01L29/06 ; H01L29/78
摘要:
A FinFET device includes a semiconductor fin, a gate electrode extending over a channel of the fin and sidewall spacers on each side of the gate electrode. A dielectric material is positioned on each side of a bottom portion of said fin, with an oxide material on each side of the fin overlying the dielectric material. A recessed region, formed in the fin on each side of the channel region, is delimited by the oxide material. A raised source region fills the recessed region and extends from the fin on a first side of the gate electrode to cover the oxide material to a height which is in contact with the sidewall spacer. A raised drain region fills the recessed region and extends from the fin on a second side of the gate electrode to cover the oxide material to a height which is in contact with the sidewall spacer.
公开/授权文献
信息查询
IPC分类: