Invention Grant
- Patent Title: Retention mechanism for shielded flex cable to improve EMI/RFI for high speed signaling
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Application No.: US14750875Application Date: 2015-06-25
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Publication No.: US09755334B2Publication Date: 2017-09-05
- Inventor: Xiang Li , Yun Ling , Chung-Hao J. Chen , Hao-Han Hsu , Shyamjith Mohan , Kuan-Yu Chen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor and Zafman LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R13/6585 ; H01R12/79 ; H01R13/6592 ; H01R12/77 ; H01R12/59 ; H01R12/88

Abstract:
A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.
Public/Granted literature
- US20160380370A1 RETENTION MECHANISM FOR SHIELDED FLEX CABLE TO IMPROVE EMI/RFI FOR HIGH SPEED SIGNALING Public/Granted day:2016-12-29
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