Invention Grant
- Patent Title: Thermally healable and reshapable conductive hydrogel composite
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Application No.: US14463884Application Date: 2014-08-20
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Publication No.: US09757496B2Publication Date: 2017-09-12
- Inventor: Jae-hyun Hur , No-kyoung Park , Kyu-hyun Im , Sang-won Kim , Sung-woo Hwang , Jang-wook Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Suwon-si KR Daejeon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Suwon-si KR Daejeon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0101278 20130826
- Main IPC: A61L27/60
- IPC: A61L27/60 ; H01B1/22 ; A61L27/50 ; A61L27/48 ; A61L27/52 ; B82Y5/00 ; C08J3/24 ; C08J3/075 ; A61L27/20 ; A61L27/44

Abstract:
An electro-conductive hydrogel composite material that may be suitable as an artificial skin satisfies all four requirements of artificial skin, namely, flexibility, electrical conductivity, healing property, and biocompatibility. The electro-conductive hydrogel composite material includes a hydrogel composition including water and a cross-linkable polymer which reversibly forms cross-linkage by hydrogen bonding; and an electro-conductive material dispersed in the hydrogen bond-based hydrogel.
Public/Granted literature
- US20150053896A1 THERMALLY HEALABLE AND RESHAPABLE CONDUCTIVE HYDROGEL COMPOSITE Public/Granted day:2015-02-26
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