Invention Grant
- Patent Title: Pre-molded sub-assemblies for implantable medical leads
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Application No.: US14692470Application Date: 2015-04-21
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Publication No.: US09757555B2Publication Date: 2017-09-12
- Inventor: Jeffrey M. Novotny , Jayesh R. Patel , Geetha Sethumadhavan , Ivan J. Talledo , Ryan T. Bauer
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/05 ; B29C45/14 ; B29K101/12 ; B29L31/00 ; A61N1/375 ; H01R24/58 ; H01R13/41

Abstract:
Pre-molded cylindrical sub-assemblies for inclusion in an implantable medical lead are described. The pre-molded cylindrical sub-assemblies comprise a cylindrical conductive element formed from a conductive material to define a substantially continuous interior surface and a substantially continuous exterior surface, and an insulative element formed from an insulative material molded onto the interior surface of the cylindrical conductive element. An interior surface of the insulative element defines a lumen of the pre-molded cylindrical sub-assembly configured to receive one or more elongated conductors of the implantable medical lead, and the cylindrical conductive element is configured to be electrically connected to one of the elongated conductors with the elongated conductors within the lumen. The cylindrical conductive element may act as an electrode, e.g., on a distal portion of the lead, or a connector, e.g., on a proximal portion of the lead.
Public/Granted literature
- US20150306376A1 PRE-MOLDED SUB-ASSEMBLIES FOR IMPLANTABLE MEDICAL LEADS Public/Granted day:2015-10-29
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