- Patent Title: Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
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Application No.: US14262437Application Date: 2014-04-25
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Publication No.: US09758373B2Publication Date: 2017-09-12
- Inventor: Stefano Losa , Raffaella Pezzuto , Roberto Campedelli , Matteo Perletti , Luigi Esposito , Mikel Azpeitia Urquia
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group LLP
- Priority: ITTO2011A0989 20111028; ITTO2012A0834 20120926
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81C1/00 ; B81B7/00

Abstract:
A method for manufacturing a protective layer for protecting an intermediate structural layer against etching with hydrofluoric acid, the intermediate structural layer being made of a material that can be etched or damaged by hydrofluoric acid, the method comprising the steps of: forming a first layer of aluminum oxide, by atomic layer deposition, on the intermediate structural layer; performing a thermal crystallization process on the first layer of aluminum oxide, forming a first intermediate protective layer; forming a second layer of aluminum oxide, by atomic layer deposition, above the first intermediate protective layer; and performing a thermal crystallization process on the second layer of aluminum oxide, forming a second intermediate protective layer and thereby completing the formation of the protective layer. The method for forming the protective layer can be used, for example, during the manufacturing steps of an inertial sensor such as a gyroscope or an accelerometer.
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