Invention Grant
- Patent Title: Polishing slurry and substrate polishing method using the same
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Application No.: US15073625Application Date: 2016-03-17
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Publication No.: US09758698B2Publication Date: 2017-09-12
- Inventor: Jin Hyung Park
- Applicant: UBMATERIALS INC.
- Applicant Address: KR
- Assignee: UBMATERIALS INC.
- Current Assignee: UBMATERIALS INC.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0038930 20150320
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; C09G1/02 ; H01L21/321

Abstract:
Provided are slurry for polishing cobalt and a substrate polishing method. The slurry includes an abrasive configured to perform the polishing, the abrasive comprising zirconium oxide particles, a dispersing agent configured to disperse the abrasive, and a polishing accelerator configured to accelerate the polishing. The polishing accelerator includes an organic acid containing an amine group and a carboxylic group. According to the slurry in accordance with an exemplary embodiment, a polishing rate of the cobalt may increases without using an oxidizing agent, and local corrosion defects on a surface of the cobalt may be suppressed.
Public/Granted literature
- US20160272847A1 POLISHING SLURRY AND SUBSTRATE POLISHING METHOD USING THE SAME Public/Granted day:2016-09-22
Information query
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