- 专利标题: Semiconductor light emitting element
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申请号: US13638470申请日: 2011-03-24
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公开(公告)号: US09761760B2公开(公告)日: 2017-09-12
- 发明人: Hidetoshi Tanaka , Mitsumasa Takeda
- 申请人: Hidetoshi Tanaka , Mitsumasa Takeda
- 申请人地址: JP Anan-shi
- 专利权人: NICHIA CORPORATION
- 当前专利权人: NICHIA CORPORATION
- 当前专利权人地址: JP Anan-shi
- 代理机构: Mori & Ward, LLP
- 优先权: JP2010-079951 20100331; JP2010-217050 20100928
- 国际申请: PCT/JP2011/057147 WO 20110324
- 国际公布: WO2011/122433 WO 20111006
- 主分类号: H01L33/38
- IPC分类号: H01L33/38 ; H01L33/44 ; H01L33/00
摘要:
A semiconductor light emitting device in which adhesion between an insulating layer and a semiconductor layer is improved while maintaining the ability of the insulating layer to limit the direction of current flow. The semiconductor light emitting device includes a semiconductor layer, a first electrode and a second electrode arranged to interpose the semiconductor layer therebetween, an insulating layer provided to the semiconductor layer at the same side as the second electrode and opposite to the first electrodes so as to surround the periphery of the second electrode, a first metal layer covering the second electrode and the insulating layer, and a second metal layer which has a thickness smaller than the thickness of the second electrode and is provided between the semiconductor layer and the insulating layer.
公开/授权文献
- US20130015470A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT 公开/授权日:2013-01-17
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