Invention Grant
- Patent Title: Electronic device package including metal blocks
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Application No.: US14279752Application Date: 2014-05-16
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Publication No.: US09768037B2Publication Date: 2017-09-19
- Inventor: Petteri Palm , Edward Fuergut , Irmgard Escher-Poeppel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/56 ; H01L21/78 ; H01L25/065 ; H01L23/31 ; H01L23/433 ; H01L23/552 ; H01L21/683 ; H01L23/00 ; H01L23/498
Abstract:
A method of manufacturing an electronic device package includes structuring a metal layer to generate a structured metal layer having a plurality of openings. Semiconductor chips are placed into at least some of the openings. An encapsulating material is applied over the structured metal layer and the semiconductor chips to form an encapsulation body. The encapsulation body is separated into a plurality of electronic device packages.
Public/Granted literature
- US20150332938A1 Electronic Device Package Including Metal Blocks Public/Granted day:2015-11-19
Information query
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