Invention Grant
- Patent Title: Mobile terminal
-
Application No.: US15123484Application Date: 2014-03-20
-
Publication No.: US09768096B2Publication Date: 2017-09-19
- Inventor: Longping Yan , Konggang Wei , Hualin Li
- Applicant: HUAWEI DEVICE CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Device Co., Ltd.
- Current Assignee: Huawei Device Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Quarles & Brady LLP
- International Application: PCT/CN2014/073784 WO 20140320
- International Announcement: WO2015/139271 WO 20150924
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L21/48 ; H01L23/367
Abstract:
A mobile terminal is provided. The mobile terminal includes a circuit board, where a chip is disposed on a first surface of the circuit board. A groove is provided on a second surface of the circuit board. The mobile terminal further includes: a heat pipe that is disposed in the groove. One end of the heat pipe extends to a side wall of the circuit board or outside a side wall of the circuit board.
Public/Granted literature
- US20170077010A1 MOBILE TERMINAL Public/Granted day:2017-03-16
Information query
IPC分类:
