Invention Grant
- Patent Title: Integrated circuit packaging system with support structure and method of manufacture thereof
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Application No.: US13425768Application Date: 2012-03-21
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Publication No.: US09768102B2Publication Date: 2017-09-19
- Inventor: Dong Ju Jeon , Koo Hong Lee , Sung Soo Kim
- Applicant: Dong Ju Jeon , Koo Hong Lee , Sung Soo Kim
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Wong & Rees LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/31
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a one-layer substrate with a symmetrical structure, the one-layer substrate having a redistribution pad and an insulation, the redistribution pad only at an insulation top side of the insulation; mounting an integrated circuit over the one-layer substrate; and forming an encapsulation over the integrated circuit.
Public/Granted literature
- US20130249078A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-09-26
Information query
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