Invention Grant
- Patent Title: Cooling systems and methods incorporating a plural in-series pumped liquid refrigerant trim evaporator cycle
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Application No.: US14682772Application Date: 2015-04-09
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Publication No.: US09772123B2Publication Date: 2017-09-26
- Inventor: Gerald McDonnell , Earl Keisling
- Applicant: Inertech IP LLC
- Applicant Address: US CT Danbury
- Assignee: Inertech IP LLC
- Current Assignee: Inertech IP LLC
- Current Assignee Address: US CT Danbury
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Main IPC: F25B7/00
- IPC: F25B7/00 ; F25B5/04 ; F25B25/00 ; F25B41/00 ; F25B6/02 ; F25B49/02 ; F25B23/00

Abstract:
Systems and methods relating to a plural in-series pumped liquid refrigerant trim evaporator cycle are described. The cooling systems include a first evaporator coil in thermal communication with an air intake flow to a heat load, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further include a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to further cool the air intake flow through the second evaporator coil when the temperature of the first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.
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