Invention Grant
- Patent Title: Tiered ECC single-chip and double-chip Chipkill scheme
-
Application No.: US14606334Application Date: 2015-01-27
-
Publication No.: US09772900B2Publication Date: 2017-09-26
- Inventor: Chaohong Hu , Uksong Kang , Hongzhong Zheng
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Convergent Law Group LLP
- Main IPC: G06F11/10
- IPC: G06F11/10

Abstract:
Exemplary embodiments provide a tiered error correction code (ECC) Chipkill system, comprising: a device ECC incorporated into at least a portion of a plurality of memory devices that corrects n-bit memory device-level failures in the respective memory device, and transmits a memory device failure signal when any memory device-level failure is greater than n-bits and beyond correction capability of the device ECC device; and a system-level ECC device external to the plurality of memory devices is responsive to receiving the memory device failure signal to correct the memory device failure based on a system ECC parity.
Public/Granted literature
- US20160011940A1 TIERED ECC SINGLE-CHIP AND DOUBLE-CHIP CHIPKILL SCHEME Public/Granted day:2016-01-14
Information query