Invention Grant
- Patent Title: Composite soft magnetic material having low magnetic strain and high magnetic flux density, method for producing same, and electromagnetic circuit component
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Application No.: US13979988Application Date: 2012-02-22
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Publication No.: US09773597B2Publication Date: 2017-09-26
- Inventor: Hiroaki Ikeda , Hiroshi Tanaka , Kazunori Igarashi
- Applicant: Hiroaki Ikeda , Hiroshi Tanaka , Kazunori Igarashi
- Applicant Address: JP Tokyo JP Niigata-Shi
- Assignee: MITSUBISHI MATERIALS CORPORATION,DIAMET CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION,DIAMET CORPORATION
- Current Assignee Address: JP Tokyo JP Niigata-Shi
- Agency: Leason Ellis LLP
- Priority: JP2011-035752 20110222; JP2012-035434 20120221
- International Application: PCT/JP2012/054245 WO 20120222
- International Announcement: WO2012/115137 WO 20120830
- Main IPC: H01F1/24
- IPC: H01F1/24 ; H01F41/02 ; B22F1/02 ; B22F3/16 ; C22C33/02 ; C22C38/02 ; H01F3/08 ; H01F27/255 ; H01F1/26 ; H01F1/33

Abstract:
A composite soft magnetic material having low magnetostriction and high magnetic flux density contains: pure iron-based composite soft magnetic powder particles that are subjected to an insulating treatment by a Mg-containing insulating film or a phosphate film; and Fe—Si alloy powder particles including 11%-16% by mass of Si. A ratio of an amount of the Fe—Si alloy powder particles to a total amount is in a range of 10%-60% by mass. A method for producing the composite soft magnetic material comprises the steps of: mixing a pure iron-based composite soft magnetic powder, and the Fe—Si alloy powder in such a manner that a ratio of the Fe—Si alloy powder to a total amount is in a range of 10%-60%; subjecting a resultant mixture to compression molding; and subjecting a resultant molded body to a baking treatment in a non-oxidizing atmosphere.
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