Invention Grant
- Patent Title: Wafer processing methods
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Application No.: US14056270Application Date: 2013-10-17
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Publication No.: US09773660B2Publication Date: 2017-09-26
- Inventor: Tae-yeong Kim , Pil-kyu Kang , Byung-lyul Park , Jin-ho Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2012-0115487 20121017
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/30 ; H01L21/68 ; H01L21/304 ; H01L21/683
Abstract:
Wafer processing methods are provided. The methods may include cutting respective edges of a wafer and an adhesive a predetermined angle before grinding a back surface of the wafer.
Public/Granted literature
- US20140106649A1 WAFER PROCESSING METHODS Public/Granted day:2014-04-17
Information query
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