Invention Grant
- Patent Title: Electronic element and manufacturing method
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Application No.: US15190147Application Date: 2016-06-22
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Publication No.: US09773746B2Publication Date: 2017-09-26
- Inventor: Kuo-Wei Tseng , Po-Chi Chen
- Applicant: Sitronix Technology Corp.
- Applicant Address: TW Hsinchu County
- Assignee: Sitronix Technology Corp.
- Current Assignee: Sitronix Technology Corp.
- Current Assignee Address: TW Hsinchu County
- Agent Winston Hsu
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/44 ; H01L23/00 ; H01L23/498
Abstract:
An electronic element for an electronic apparatus includes a substrate; a bump, disposed on the substrate for electrically connecting the electronic apparatus; and at least one under bump metal layer, disposed between the bump and the substrate for the bump to be attached to the substrate; wherein the UBM layer forms a breach structure.
Public/Granted literature
- US20160379949A1 Electronic Element and Manufacturing Method Public/Granted day:2016-12-29
Information query
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