Invention Grant
- Patent Title: Array substrate, fabricating method thereof, and display device
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Application No.: US15108607Application Date: 2015-12-10
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Publication No.: US09773855B2Publication Date: 2017-09-26
- Inventor: Yanbing Wu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201510409446 20150713
- International Application: PCT/CN2015/096954 WO 20151210
- International Announcement: WO2017/008434 WO 20170119
- Main IPC: H01L27/32
- IPC: H01L27/32 ; G09G3/3266 ; G09G3/3225 ; H01L51/56
Abstract:
An array substrate, a method for fabricating the array substrate, and a related display device are provided. The array substrate comprises: a base substrate with a plurality of first via holes; a plurality of first signal lines on a first side of the base substrate; and a plurality of first signal driver lines on a second side of the base substrate; wherein each first signal line is connected with at least one first signal driver line through at least one first via hole.
Public/Granted literature
- US20170148864A1 ARRAY SUBSTRATE, FABRICATING METHOD THEREOF, AND DISPLAY DEVICE Public/Granted day:2017-05-25
Information query
IPC分类:
