Invention Grant
- Patent Title: Piezoelectric printhead assembly
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Application No.: US15307091Application Date: 2014-04-30
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Publication No.: US09776404B2Publication Date: 2017-10-03
- Inventor: Peter J Fricke , Andrew L Van Brocklin
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- International Application: PCT/US2014/036005 WO 20140430
- International Announcement: WO2015/167484 WO 20151105
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14 ; B41J2/155
Abstract:
A piezoelectric printhead assembly can include a plurality of piezoelectric micro-electro mechanical system (MEMS) dies each having a first application-specific integrated circuit (ASIC) die coupled to a respective piezoelectric MEMS die and a second ASIC die coupled to the respective piezoelectric MEMS die.
Public/Granted literature
- US20170050438A1 PIEZOELECTRIC PRINTHEAD ASSEMBLY Public/Granted day:2017-02-23
Information query
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