Invention Grant
- Patent Title: Dielectric pastes for aluminum substrates
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Application No.: US14911035Application Date: 2014-10-06
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Publication No.: US09776911B2Publication Date: 2017-10-03
- Inventor: Srinivasan Sridharan , Orville W. Brown , George E. Graddy, Jr.
- Applicant: Ferro Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: Ferro Corporation
- Current Assignee: Ferro Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Rankin, Hill & Clark LLP
- International Application: PCT/US2014/059219 WO 20141006
- International Announcement: WO2015/065654 WO 20150507
- Main IPC: H01B3/08
- IPC: H01B3/08 ; C03C3/00 ; C03C8/16 ; C09K5/14 ; H05K1/03 ; H05K1/05 ; H05K3/20 ; C03C3/097 ; C03C8/08 ; C03C8/14
Abstract:
High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.
Public/Granted literature
- US20160185651A1 Dielectric Pastes For Aluminum Substrates Public/Granted day:2016-06-30
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