Invention Grant
- Patent Title: Cooling device and heating and cooling apparatus
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Application No.: US14536126Application Date: 2014-11-07
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Publication No.: US09777974B2Publication Date: 2017-10-03
- Inventor: Gaku Kamitani , Atsuhiko Hirata
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2012-107904 20120509
- Main IPC: F28F27/02
- IPC: F28F27/02 ; F04B43/04 ; F28D21/00

Abstract:
An analyzing device includes a heating device, a cooling device, and a controller. The cooling device includes a piezoelectric pump, a check valve, an exhaust valve, and an air tank. The analyzing device heats a subject by the heating device. The cooling device drives the piezoelectric pump while the heating device heating the subject. With this, the outside air is sucked through a suction port and the air that is discharged from the piezoelectric pump is accommodated in the air tank through the check valve. Then, the pressure in the air tank is increased. Thereafter, the cooling device stops driving of the piezoelectric pump. With this, the air in the air tank is discharged toward the subject via the exhaust valve so as to cool the subject.
Public/Granted literature
- US20150060012A1 COOLING DEVICE AND HEATING AND COLLING APPARATUS Public/Granted day:2015-03-05
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