Invention Grant
- Patent Title: Integrated circuit chip assembled on an interposer
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Application No.: US15204488Application Date: 2016-07-07
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Publication No.: US09780015B2Publication Date: 2017-10-03
- Inventor: Pierre Bar , Alisee Taluy , Olga Kokshagina
- Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Montrouge FR Crolles
- Assignee: STMicroelectronics SA,STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics SA,STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Montrouge FR Crolles
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1452280 20140319
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L21/3213 ; H01L21/768 ; H01L23/36
Abstract:
A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.
Public/Granted literature
- US20160322276A1 INTEGRATED CIRCUIT CHIP ASSEMBLED ON AN INTERPOSER Public/Granted day:2016-11-03
Information query
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