- 专利标题： Integrated circuit chip assembled on an interposer
-
申请号： US15204488申请日： 2016-07-07
-
公开(公告)号： US09780015B2公开(公告)日： 2017-10-03
- 发明人: Pierre Bar , Alisee Taluy , Olga Kokshagina
- 申请人： STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
- 申请人地址： FR Montrouge FR Crolles
- 专利权人： STMicroelectronics SA,STMicroelectronics (Crolles 2) SAS
- 当前专利权人： STMicroelectronics SA,STMicroelectronics (Crolles 2) SAS
- 当前专利权人地址： FR Montrouge FR Crolles
- 代理机构： Gardere Wynne Sewell LLP
- 优先权： FR1452280 20140319
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L21/3213 ; H01L21/768 ; H01L23/36
摘要：
A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal lines run on the upper surface of the interposer and are arranged between conductive elements of connection to the chip. An end of each first metal line is arranged to extend beyond a projection of the chip on the interposer. A thermally-conductive via connects the end of the first metal line to a heat sink supported at an upper surface of the device.
公开/授权文献
- US20160322276A1 INTEGRATED CIRCUIT CHIP ASSEMBLED ON AN INTERPOSER 公开/授权日：2016-11-03
信息查询
IPC分类:
