Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US15052219Application Date: 2016-02-24
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Publication No.: US09780024B2Publication Date: 2017-10-03
- Inventor: In Ho Kim , Jae Yun Kim , Kyeong Sool Seong
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0026601 20150225
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor package and a method of making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a conductive layer that comprises an anchor portion extending through at least one dielectric layer.
Public/Granted literature
- US20160254221A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-09-01
Information query
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