Invention Grant
- Patent Title: Die cushion device
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Application No.: US14704469Application Date: 2015-05-05
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Publication No.: US09782816B2Publication Date: 2017-10-10
- Inventor: Yasuyuki Kohno , Tadahiro Kondo
- Applicant: AIDA ENGINEERING, LTD.
- Applicant Address: JP Kanagawa
- Assignee: AIDA ENGINEERING, LTD.
- Current Assignee: AIDA ENGINEERING, LTD.
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2014-120394 20140611
- Main IPC: B21D24/14
- IPC: B21D24/14 ; B21D24/02 ; F15B1/02 ; F15B21/00

Abstract:
There is provided a die cushion device that includes a cushion pad, a hydraulic cylinder configured to lift the cushion pad, and a hydraulic closed circuit connected to a die cushion pressure creation chamber of the hydraulic cylinder. The hydraulic closed circuit includes a pilot drive type logic valve that is operable as a main relief valve at the time of the die cushion operation, and a pilot relief valve configured to create pilot pressure for controlling the logic valve. Hydraulic oil is filled in the hydraulic closed circuit, in a pressurized manner, and the hydraulic oil in the hydraulic closed circuit is pressurized by only die cushion force applied from the cushion pad through the hydraulic cylinder, in one cycle period of the cushion pad.
Public/Granted literature
- US20150360274A1 DIE CUSHION DEVICE Public/Granted day:2015-12-17
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