Invention Grant
- Patent Title: Memory devices and modules
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Application No.: US14863446Application Date: 2015-09-23
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Publication No.: US09785570B2Publication Date: 2017-10-10
- Inventor: Chaohong Hu , Hongzhong Zheng , Dimin Niu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Main IPC: G06F11/10
- IPC: G06F11/10 ; G06F12/1009

Abstract:
An embodiment includes a system, comprising: an Error Correcting Code (ECC) memory comprising a plurality of memory locations, each memory location corresponding to a device address of the ECC memory; a system management bus (SMB); a baseboard management controller (BMC) coupled to the ECC memory through the SMB; and an operating system comprising a driver module coupled to the BMC through the SMB, the driver module being configured to receive through the Memory device address information associated with the ECC memory and to convert the device address information into physical address information independent of an ECC memory controller.
Public/Granted literature
- US20160266975A1 MEMORY DEVICES AND MODULES Public/Granted day:2016-09-15
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