- 专利标题： Apparatus for processing semiconductor wafers, in particular for carrying out a polymers removal process step
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申请号： US14952076申请日： 2015-11-25
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公开(公告)号： US09786525B2公开(公告)日： 2017-10-10
- 发明人: Dario Tenaglia , Sebastiano Cali
- 申请人： STMicroelectronics S.R.L.
- 申请人地址： IT Agrate Brianza
- 专利权人： STMICROELECTRONICS S.R.L.
- 当前专利权人： STMICROELECTRONICS S.R.L.
- 当前专利权人地址： IT Agrate Brianza
- 代理机构： Seed Intellectual Property Law Group LLP
- 优先权： ITM111A0646 20110415
- 主分类号： B08B3/02
- IPC分类号： B08B3/02 ; H01L21/02 ; H01L21/67 ; B08B3/10 ; H01L21/306 ; H01L21/677
摘要：
An apparatus for processing semiconductor wafers includes at least a wet bench and an automatic handling system of a wafer carrier removably connected thereto. The wet bench includes a first processing tank, a second processing tank and a third processing tank, separated from one another, each processing tank being dedicated to a different chemical, as well as a special cleaning and drying tank for processing the automatic handling system when the wafer carrier has been removed.
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