Invention Grant
- Patent Title: Dual-side reinforcement flux for encapsulation
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Application No.: US14908986Application Date: 2014-07-31
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Publication No.: US09786629B2Publication Date: 2017-10-10
- Inventor: Ramakrishna Hosur Venkatagiriyappa , Sutapa Mukherjee , Harish Hanchina Siddappa , Morgana De Avila Ribas , Siuli Sarkar , Bawa Singh , Rahul Raut
- Applicant: Alpha Assembly Solutions Inc.
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: IN3497/CHE/2013 20130802
- International Application: PCT/US2014/049046 WO 20140731
- International Announcement: WO2015/017615 WO 20150205
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/29 ; H01L23/00 ; H01L21/66 ; H05K3/28 ; H05K3/34
Abstract:
Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.
Public/Granted literature
- US20160163672A1 DUAL-SIDE REINFORCEMENT FLUX FOR ENCAPSULATION Public/Granted day:2016-06-09
Information query
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