Invention Grant
- Patent Title: Package, made of building material, for a parameter monitoring device, within a solid structure, and relative device
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Application No.: US14401332Application Date: 2013-05-23
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Publication No.: US09791303B2Publication Date: 2017-10-17
- Inventor: Alberto Pagani , Bruno Murari , Federico Giovanni Ziglioli , Marco Ronchi , Giulio Ricotti
- Applicant: STMICROELECTRONICS S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Slater Matsil, LLP
- Priority: ITMI2012A0912 20120525
- International Application: PCT/EP2013/060669 WO 20130523
- International Announcement: WO2013/174946 WO 20131128
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01M5/00 ; B28B23/00 ; G01K17/00 ; G01L1/18 ; G01N33/38
Abstract:
A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.
Public/Granted literature
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