Invention Grant
- Patent Title: Method to realize reconfigurable memory topology
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Application No.: US14968698Application Date: 2015-12-14
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Publication No.: US09791899B2Publication Date: 2017-10-17
- Inventor: Gong Ouyang , Kai Xiao , Lu-Vong Phan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor and Zafman LLP
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K1/18 ; H05K3/22 ; G06F1/16

Abstract:
An apparatus and method to permit reconfiguration of a memory topology. A printed circuit board (PCB) has a central processing unit (CPU) connector coupled a pair of dual inline memory module (DIMM) connectors coupled thereto. The PCB defines an electrical access channel coupling the pair of DIMM connectors into a T topology having a first branch and a second branch. The second branch of the T topology is electrically discontinuous with the rest of the T topology proximate to a T junction. A bridge may be provided to span the discontinuity.
Public/Granted literature
- US20170168528A1 METHOD TO REALIZE RECONFIGURABLE MEMORY TOPOLOGY Public/Granted day:2017-06-15
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