Invention Grant
- Patent Title: Patterning by stamped metal resist
-
Application No.: US12331062Application Date: 2008-12-09
-
Publication No.: US09793481B2Publication Date: 2017-10-17
- Inventor: Stephen R. Forrest , Momchil T. Mihnev , Andre D. Taylor , Xin Xu
- Applicant: Stephen R. Forrest , Momchil T. Mihnev , Andre D. Taylor , Xin Xu
- Applicant Address: US MI Ann Arbor
- Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee Address: US MI Ann Arbor
- Agency: Riverside Law LLP
- Main IPC: H01L51/00
- IPC: H01L51/00

Abstract:
A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the first layer via stamping. The second layer comprising a second material. The second layer covers a first portion of the first layer, and does not cover a second portion of the first layer. The second portion of the first layer is removed via a subtractive process while the first portion of the first layer is protected from removal by the patterned second layer.
Public/Granted literature
- US20100080914A1 PATTERNING BY STAMPED METAL RESIST Public/Granted day:2010-04-01
Information query
IPC分类: