Invention Grant
- Patent Title: Connection structural member and connection structural member module, and probe card assembly and wafer testing apparatus using the same
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Application No.: US15175023Application Date: 2016-06-06
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Publication No.: US09793635B2Publication Date: 2017-10-17
- Inventor: Jun-hee Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0117338 20150820
- Main IPC: H01R13/24
- IPC: H01R13/24 ; G01R1/02 ; G01R1/073 ; G01R31/28 ; H01R12/73 ; H01R12/71
Abstract:
An apparatus comprising: a barrel having an first hole and a second hole opposite to the first hole; a first plunger disposed in the first hole and including a hook shape; a second plunger disposed in the second hole; and an elastic connection member disposed within the barrel to connect the first plunger and the second plunger.
Public/Granted literature
Information query
