Invention Grant
- Patent Title: Apparatus for dipping substrate
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Application No.: US14892900Application Date: 2015-05-19
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Publication No.: US09795982B2Publication Date: 2017-10-24
- Inventor: Eun-Ah You
- Applicant: Korea Research Institute of Standards and Science
- Applicant Address: KR Daejeon
- Assignee: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Current Assignee: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Current Assignee Address: KR Daejeon
- Agency: Hauptman Ham, LLP
- Priority: KR10-2015-0066418 20150513
- International Application: PCT/KR2015/004992 WO 20150519
- International Announcement: WO2016/182107 WO 20161117
- Main IPC: B05C3/00
- IPC: B05C3/00 ; B05C3/02 ; B05C13/02 ; B05C3/04 ; C25D17/00

Abstract:
An apparatus for dipping a substrate includes: a body having an internal plate formed therein, and including a backing plate provided over the internal plate; a crucible accommodating an aqueous solution therein and provided over the backing plate; a crucible driving unit provided in the body and connected to the crucible to move the crucible in a horizontal direction or a vertical direction of the body; a support having a lower end to which a substrate is fixed; a support driving unit provided to an upper side of the body and connected to the support to drive the support in a length direction of the support or rotate the support in the vertical direction of the body; and a controlling unit connected to the crucible driving unit and the support driving unit to control driving of the crucible driving unit and the support driving unit.
Public/Granted literature
- US20170106394A1 APPARATUS FOR DIPPING SUBSTRATE Public/Granted day:2017-04-20
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