Invention Grant
- Patent Title: Micro-sensor body and method for manufacturing the same, as well as micro-sensor
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Application No.: US14778721Application Date: 2015-04-15
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Publication No.: US09796577B2Publication Date: 2017-10-24
- Inventor: Chunyan Ji , Tian Yang
- Applicant: Boe Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201410601932 20141030
- International Application: PCT/CN2015/076636 WO 20150415
- International Announcement: WO2016/065857 WO 20160506
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; C23C14/06 ; C23C14/14 ; C23C14/34 ; G01F1/56 ; G01J1/42 ; H02S20/00 ; F24J2/52

Abstract:
The present disclosure relates to the field of sensor manufacturing technology, particularly discloses a method for manufacturing a micro-sensor body, comprising the steps of S1: applying a wet colloidal material on a substrate to form a colloidal layer, and covering a layer of one-dimensional nanowire film on the surface of the colloidal layer to form a sensor embryo; S2: drying the colloidal layer of the sensor embryo to an extent that the colloidal layer cracks into a plurality of colloidal islands, a portion of the one-dimensional nanowire film contracting into a contraction diaphragm adhered to the surface of the colloidal islands while the other portion of the one-dimensional nanowire film being stretched into a connection structure connected between the adjacent contraction diaphragms. By the method for manufacturing a micro-sensor body of the present disclosure, the contraction diaphragms and connection structures formed by stretching the one-dimensional nanowire film are connected stably, which enhances the stability of the sensor devices; and the cracking manner renders it easy to obtain a large-scale of sensor bodies with connection structure arrays in stable suspension.
Public/Granted literature
- US20160052775A1 MICRO-SENSOR BODY AND METHOD FOR MANUFACTURING THE SAME, AS WELL AS MICRO-SENSOR Public/Granted day:2016-02-25
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