Invention Grant
- Patent Title: Reduced-profile data transmission element connectors, adapters, and connection assemblies thereof
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Application No.: US15070770Application Date: 2016-03-15
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Publication No.: US09798090B2Publication Date: 2017-10-24
- Inventor: Kazuyoshi Takano , Kenji Iizumi
- Applicant: Senko Advanced Components, Inc.
- Applicant Address: US MA Marlborough
- Assignee: Senko Advanced Components, Inc.
- Current Assignee: Senko Advanced Components, Inc.
- Current Assignee Address: US MA Marlborough
- Agency: Pepper Hamilton LLP
- Main IPC: G02B6/38
- IPC: G02B6/38

Abstract:
Reduced-profile connection components are described. The reduced-profile connection components are configured to connect various data transmission elements, including cables, network devices, and computing devices. A non-limiting example of a connection component includes a fiber optic connection component, including connectors, adapters, and assemblies formed therefrom. In some embodiments, the connection components may include mechanical transfer (MT) and multi-fiber push-on/pull-off (MPO) connection components, such as MT ferrules and MPO adapters. The reduced-profile connection components configured according to some embodiments have a smaller profile and/or require less parts to achieve a connection compared to conventional connection components. In some embodiments, the reduced-profile connection components may be used with conventional connection components. For example a reduced-profile connector may use a conventional MT ferrule to establish a connection within a conventional MPO adapter.
Public/Granted literature
- US09766412B2 Reduced-profile data transmission element connectors, adapters, and connection assemblies thereof Public/Granted day:2017-09-19
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