Invention Grant
- Patent Title: Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
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Application No.: US14492113Application Date: 2014-09-22
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Publication No.: US09798968B2Publication Date: 2017-10-24
- Inventor: David Finn , Mustafa Lotya , Darren Molloy
- Applicant: David Finn , Mustafa Lotya , Darren Molloy
- Applicant Address: IE Lower Churchfield, Tourmakeady, Co. Mayo
- Assignee: Féinics AmaTech Teoranta
- Current Assignee: Féinics AmaTech Teoranta
- Current Assignee Address: IE Lower Churchfield, Tourmakeady, Co. Mayo
- Agent Gerald E. Linden
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01Q1/22 ; H01Q1/38 ; H01Q7/00 ; B23K26/362 ; B23K26/40 ; B23K101/40 ; B23K103/00

Abstract:
A conductive coupling frame (CF) having two ends, forming an open loop having two ends or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM, 610), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S) or a non-conductive strip (NCS, 1034) extending from a module opening (MO) to a periphery of the card body to function as a coupling frame (CF). The coupling frame (CF) may be thick enough to be non-transparent to RF at frequencies of interest. A switch (SW) may be provided to connect ends of the coupling frame (CF) across the slit (S, 630). A reinforcing structure (RS) may be provided to stabilize the coupling frame (CF) and card body (CB). The transponder chip module (TCM) may comprise an antenna structure which may be a laser-etched antenna structure (LES) or a chemical-etched antenna structure (CES), and may comprise and a non-perforated contact pad (CP) arrangement. A coupling frame (CF) may be incorporated onto the module tape (MT, CCT) for a transponder chip module (TCM).
Public/Granted literature
- US20150021403A1 SMARTCARD WITH COUPLING FRAME AND METHOD OF INCREASING ACTIVATION DISTANCE OF A TRANSPONDER CHIP MODULE Public/Granted day:2015-01-22
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