Invention Grant
- Patent Title: Method for coating a substrate
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Application No.: US15093834Application Date: 2016-04-08
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Publication No.: US09799554B2Publication Date: 2017-10-24
- Inventor: Katrin Fischer , Florian Palitschka , Darren Robert Southworth , William Whitney
- Applicant: SUSS MicroTec Lithography GmbH
- Applicant Address: DE
- Assignee: SUSS MicroTec Lithography GmbH
- Current Assignee: SUSS MicroTec Lithography GmbH
- Current Assignee Address: DE
- Agency: Hayes Soloway PC
- Priority: NL2014598 20150408
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/768 ; H01L21/02
Abstract:
A method for coating substrates provided with vias uses a first step in which the substrate is conditioned and a second step in which the substrate is coated with an electrically insulating material such that the vias are filled up completely.
Public/Granted literature
- US20160300759A1 Method for Coating a Substrate Public/Granted day:2016-10-13
Information query
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