Invention Grant
- Patent Title: Chip package having die structures of different heights and method of forming same
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Application No.: US15003150Application Date: 2016-01-21
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Publication No.: US09806058B2Publication Date: 2017-10-31
- Inventor: Wen-Hsin Wei , Chi-Hsi Wu , Chen-Hua Yu , Hsien-Pin Hu , Shang-Yun Hou , Wei-Ming Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L25/00 ; H01L23/538 ; H01L25/065 ; H01L25/18 ; H01L21/56
Abstract:
Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
Public/Granted literature
- US20170005072A1 STRUCTURE AND FORMATION METHOD FOR CHIP PACKAGE Public/Granted day:2017-01-05
Information query
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