An in-ear earphone including a housing, a speaker unit and an earpad is provided. The housing has a tube portion. The speaker unit is disposed inside the tube portion. The earpad has a connecting portion and a wrapping portion connected to the connecting portion. The connecting portion is assembled to an audio outlet end of the tube portion. The connecting portion and the speaker unit are surrounded and wrapped by the wrapping portion. Only the tube portion exists between an annular sidewall of the speaker unit and the wrapping portion.